| 2002 №07 (05) | 2002 №07 (07) |
The Paton Welding Journal, 2002, #7, 36-37 pages
Vacuum diffusion bonding of chromium to copper
G.K. Kharchenko1, Yu.V. Falchenko1, O.A. Novomlinets1, V.F. Gorban2
1E.O. Paton Electric Welding Institute of the NASU 11 Kazymyr Malevych Str., 03150, Kyiv, Ukraine.2I.M. Frantsevich Institute for Materials Science Problems, NASU, Kyiv, Ukraine
Abstract
The technology for vacuum diffusion bonding (VDB) of chromium to copper has been developed to manufacture bimetal cathodes used for making wear-resistant friction layers and decorative coatings. It has been established that VDB results in deposition of copper on chromium in the contact zone. The mechanism of deformation of the perforated copper interlayer has been studied. The use of such an interlayer is shown to hold promise for VDB of chromium to copper.
Keywords: vacuum diffusion bonding, chromium, copper, perforated interlayer, deformation
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