Electrometallurgy Today, 2022, №03



2022 №03 (06)

DOI of Article 10.37434/sem2022.03.07

2022 №03 (08)

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Electrometallurgy Today (Sovremennaya Elektrometallurgiya), 2022, #3, 44-52 pages

Influence of Al–Si AND Al–Cu multilayer on the formation of the joint structure of SiC_Р–АМг5 composite during diffusion welding

A.I. Ustinov, T.V. Melnychenko, Yu.V. Falchenko, L.V. Petrushinets

E.O. Paton Electric Welding Institute of the NAS of Ukraine. 11 Kazymyr Malevych Str., Kyiv, 03150, Ukraine. E-mail: office@paton.kiev.ua

Abstract
The regularities of joint structure formation in diffusion pressure welding through multilayer interlayers based on Al–Si and Al–Cu aluminum systems with eutectic, obtained by electron beam deposition in vacuum, were studied, using SiCp–AMg5 aluminum composite, as an example. It is shown that the intermediate multilayer layers of eutectic composition provide permanent joints without degradation of the properties of the base material at a temperature of 500 °C, which corresponds to the beginning of intensive plastic deformation of the interlayer under pressure. It is established that the nature of the diffusion interaction of the components of the interlayer and the composite and the phase composition of the eutectic affect the structure and the chemical composition of the joint. Conditions that prevent the formation of barrier layers at the interlayer/composite interface, namely layer alloying or intermetallic particle formation in it before the welding process, promote intensive mass transfer of interlayer and composite components, ensuring homogeneity of the structure and microhardness of the joint. Mechanisms for forming SiCp–AMg5 composite joint through multilayer intermediate layers based on aluminum systems with eutectic of different types — simple, consisting of system components (for example Al–Si) and one containing an intermetallic based on components (for example Al–Cu) are proposed. Ref. 18, Tabl. 3, Fig. 9.
Keywords: multilayer foil; EB-PVD; composite; diffusion welding; joint; microstructure

Received 22.06.2022

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