Electrometallurgy Today (Sovremennaya Elektrometallurgiya), 2022, #4, 9-14 pages
The influence of copper on the heat resistance of thin foils of high-entropy alloys of the Cr–Fe–Co–Ni–Cu system obtained by the electron beam deposition method
A.I. Ustinov, S.O. Demchenkov, T.V. Melnychenko, O.Yu. Klepko
E.O. Paton Electric Welding Institute of the NAS of Ukraine.
11 Kazymyr Malevych Str., 03150, Kyiv, Ukraine. E-mail: email@example.com
High-entropy alloys are characterized by a complex of mechanical properties, which allows them to be considered
promising structural materials. Given that the phase composition of high-entropy alloys remains stable with increasing
temperature, it is assumed that they can be used to manufacture structural elements of aerospace equipment operated at
elevated temperatures. Electron beam technology makes it possible to obtain thin-sheet material based on these alloys,
which greatly simplifies the technology of manufacturing thin-walled elements, such as light heat-shielding honeycomb
panels for thermal protection of aircraft. In this regard, the paper investigated the heat resistance of thin-sheet materials
based on the Cr–Fe–Co–Ni–Cu system, depending on the copper content in the alloy. It is shown that the content of
copper in the composition of high-entropy alloys significantly affects the heat resistance of the material: in the case of
CrFeCoNiCu alloy foils, the increase in specific mass at a temperature of 900 °С occurs 8 times more intensively than
in CrFeCoNi foils, due to the activation of the diffusion of copper atoms, its release to the surface of the foil and scale
formation based on CuO and NiO oxides with a significant number of defects in the structure. CrFeCoNi alloy foils are
characterized by higher heat resistance due to the formation of scale on the surface based on Cr2O3 oxide with fewer
defects and greater integrity. The average mass growth rate of the CrFeCoNi alloy sample is about 0.041 mg/(cm2∙h).
Ref. 16, Tabl. 2, Fig. 3.
high-entropy alloys; electron beam deposition; ingot; thin foils; heat resistance; microstructure
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