Print
2001 №02 (03) 2001 №02 (05)

The Paton Welding Journal 2001 #02
The Paton Welding Journal, 2001, #2, 16-19 pages

Formation of embrittled layers on titanium at its interaction with steel technological fixture under the conditions of diffusion bonding

V.V. Shurupov1, V.V. Peshkov1, M.N. Shushpanov1, L.S. Kireev2

1Voronezh Aircraft Stock Society, Voronezh, Russia
2E.O. Paton Electric Welding Institute of the NASU 11 Kazymyr Malevych Str., 03150, Kyiv, Ukraine.

Abstract
In diffusion bonding, the embrittled diffusion layers are formed at the titanium alloy surface as a result of a contact interaction of VT6 alloy products with a steel technological fixture. In contact with steel 12Kh18N10T the process of formation of embrittled layers is controlled by a heterodiffusion of steel components in the diffusion zone, containing intermetallics, while in contact with steel 20 - by carbon diffusion in the carbide-containing layer, interlocking iron diffusion into titanium.
Keywords: diffusion bonding, technological fixture, embrittled layer, contact interaction, intermetallics

References

1. Bondar, A.V., Peshkov, V.V., Kireev, L.S. et al. (1998) Diffusion bonding of titanium and its alloys. Voronezh: VSU.
2. Fedorov, S.N., Bondar, A.V., Peshkov, V.V. et al. (2000) Contact of titanium components with steel fixture in diffusion bonding. Avtomaticheskaya Searka, 1, 23-26.
3. Charukhina, K.E., Golovanenko, S.A., Masterov, V.A. et al. (1970) Bimetal joints. Moscow: Metallurgia.
4. Tsvikker, U. (1979) Titanium and its alloys. Moscow: Metallurgia.
5. Peshkov, V.V., Del, G.D., Orlova, L.M. et al. (1986) Determination of depth of oxidized layer embrittled part at the titanium surface. Zavod. Laboratoria, 9, 75-77.
6. Vulf, B.K. (1969) Heat treatment of titanium alloys. Moscow: Metallurgia.

Suggested Citation

V.V. Shurupov, V.V. Peshkov, M.N. Shushpanov, L.S. Kireev (2001) Formation of embrittled layers on titanium at its interaction with steel technological fixture under the conditions of diffusion bonding. The Paton Welding J., 02, 16-19.