2014 №11 (03) DOI of Article
2014 №11 (05)

The Paton Welding Journal 2014 #11
The Paton Welding Journal, 2014, #11, 24-27 pages  



1E.O. Paton Electric Welding Institute, NASU. 11 Bozhenko Str., 03680, Kiev, Ukraine. E-mail:
2OJSC «Institute Tsvetmetobrabotka». 5 Pyzhevsky Lane, 119017, Moscow, RF. E-mail:
The wide application of commercial grades of copper, containing different impurities, in many fields of industry requires profound analysis of their influence on weldability. At the present work the integrated evaluation of effect of main impurities on copper susceptibility to formation of cracks and pores was made using electron-fractographic and X-ray analysis and also new methods, developed by the authors, for evaluation of tendency of copper to formation of solidification cracks. It is shown that simultaneous presence of different impurities in copper unlike the binary system of copper-impurity reduces its tendency to solidification crack formation. Content of 0.2 % Ni increases the crack resistance of copper. It was established that level of influence of low-melting impurities on crack formation in weld metal and near-weld zone depends on their distribution coefficient. It was for the first time established that low-melting surface-active impurities with a low distribution coefficient (K< 0.05) increase the tendency of welds to pore formation. The obtained results of investigations allow developing new consumables for welding of copper and its alloys. 15 Ref.. 2 Tables, 3 Figures.
Keywords: copper, impurities, solidification cracks, pores, electron-fractographic and X-ray spectral analysis, distribution coefficient
Received:                19.06.14
Published:               28.11.14
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