The Paton Welding Journal, 2006, №03

2006 №03 (06)

2006 №03 (08)

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The Paton Welding Journal, 2006, #3, 30-32 pages

Flame soldering for joining microelements to printed circuit boards

S.P. Pavlyuk¹, G.N. Kutlin¹, V.M. Kislitsyn², A.G. Musin²

¹T. Shevchenko Kiev National University, Kiev, Ukraine
²E.O. Paton Electric Welding Institute of the NASU. 11 Kazymyr Malevych Str., 03150, Kyiv, Ukraine.

Abstract
Described is a new process for joining microcircuit leads to tracks on printed circuit boards. The soldering method is suggested, allowing increase in element packaging density and elimination of operator’s mistakes. Results of comparative tensile tests of the joints heated by a hydrogen-oxygen mixture flame and hot gas are given.
Keywords: soldering, printed circuit board, flame heating, hydrogen-oxygen mixture, forced cooling, strength of joints

References

1. Kislitsyn, V.M. (1987) Technology of resistance soldering of silicon diodes. Syn. of Thesis for Cand. of Techn. Sci. Degree. Kiev.
2. Pavlyuk, S.P., Rossoshinsky, A.A., Kislitsyn, V.M. et al. (1999) Application of silicon as heating element of microsoldering tools. Avtomatich. Svarka, 2, 41–44.
3. Azdasht, G., Zakel, E., Reichl, H. (1996) Implementation of low power diode laser for soldering by FPS method. Soldering and Surface Mount Technology, 22, 51–54.

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Suggested Citation

S.P. Pavlyuk, G.N. Kutlin, V.M. Kislitsyn, A.G. Musin (2006) Flame soldering for joining microelements to printed circuit boards. The Paton Welding J., 03, 30-32.

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